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Artificial intelligence plays a key role in autonomous vehicle technologies. Equipped with the NVIDIA® Jetson Orin Nano™ 8GB module, the ATC 3562 offers up to 67 TOPS of inference performance with SUPER Mode enabled, ideal for advanced driver assistance systems (ADAS), automatic plate recognition (ANPR), autonomous mobile robots (AMR), machine learning (ML), intelligent transportation systems (ITS), and rail safety.

Thanks to its optimized heat dissipation design and IP67 certification, it maintains this performance even in harsh environments, guaranteeing stable real-time inference.

Designed for on-board and railway applications, it supports a 9V to 36V/24V power supply with IGN control, features GMSL2 and GbE PoE interfaces for cameras and long-range LiDAR sensors, as well as a wide range of connectivity: USB 3.2, isolated CAN FD, RS-232, console port, digital I/O, OTG and HDMI®.

With optional 5G NR and Wi-Fi 5/6 modules, it can connect to cyber-physical systems (CPS) for AI model retraining, improving accuracy in the field.

Robust, it operates from -25°C to 65°C, resists shock and vibration (MIL-STD-810H) and is CE/FCC Class A, UKCA, EN 50155, EN 45545-2 and E-mark certified.

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14-slot backplane in PICMG1.0 format

- ATX / AT management - 2 PICMG 1.0 ports - 7 PCI ports -5 ISA ports

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13-slot backplane in hybrid PICMG1.3 format

- ATX management - 1 PICMG 1.3 port - 4 PCIe 1x ports - 1 PCIe 16x port -4 ISA ports -3 PCI 32bit ports

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13-slot backplane in PICMG1.3 format

- ATX management - 1 PICMG 1.3 port - 4 PCIe 4x ports (via bridge)- 1 PCIe 16x port- 7 PCI 32bit ports

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ATX-format motherboard, supporting an ^Intel® Core™ i7/i5/i3 SKYLAKE or KABY LAKE processor.

- Intel® Q170 PCH chipset - 4 Dual channel DDR4 1866/2133MHz DIMM slots (non-ECC), up to 64GB - 4 SATA 3.0 ports (RAID 0, 1, 5 and 10 support)- 2 RJ45 Intel Gigabit networks- 1 PCIe x16 port, 2 PCIe x4 ports, 4 PCI 32b ports - 2 HDMI and 1 VGA ports - 12 USB ports and 6 COM ports (via brackets)

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Motherboard in PICMG1.3 format, supporting an ^Intel® Core™ i7/i5/i3 SKYLAKE processor.

- Intel® Q170/ H110 PCH chipset (depending on model selected) - 2 Dual channel 1866/2133MHz DDR4 DIMM slots (non-ECC), up to 32GB - 5 SATA 3.0 ports (RAID 0, 1, 5 and 10 support)- 2 RJ45 Intel Gigabit networks- M.2 NVMe 2280/22110 port (Q model only) - VGA port, and DVI or HDMI or DP option - 10 USB ports and 4 COM ports (via brackets)

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Modular 2U chassis for up to four CPUs.

- EIA RS-310C 2U standard chassis
- Rugged lightweight aluminum construction
- Redundant, extractable 1200W power supply (110-240VAC)
- Support for dual-processor Intel XEON/CORE Skylake or KabyLake CPU modules,
- 4 CPU module slots

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Robust, high-performance 5U rack-mount industrial server.

- EIA RS-310C 5U standard chassis
- Robust, lightweight aluminum construction
- Redundant, extractable 1200W (110-240VAC) independent power supplies for each segment
- HDEC CPU card for dual-processor Intel XEON Silver or Gold, supporting up to 88 PCIe Gen.3 lines
- Support for a wide range of HDEC backplanes, to match PCIe slot requirements in terms of number and/or performance

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4U military chassis equipped to accommodate 2 independent motherboards, in the smallest possible footprint.

- 4U standard EIA RS-310C chassis
- Robust, lightweight construction in anti-corrosive painted aluminum to MIL-DTL-5541 standard
- Removable 520W (110-240VAC) independent power supplies for each segment
- Each segment is equipped with a PICMG 1.3 CPU board for dual Intel XEON processors, and a PCIe backplane.
- Certified and tested to MIL-STD-810G and MIL-STD-461F standards
- MIL-STD-1553B ARINC 429-certified rear-panel I/O connectors

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2.5' SSD for extreme conditions

The 3TR6-P 2.5" SATA3 SSD is the latest addition to the InnoRobust product range, adopting industrial 3D TLC NAND technology. The 3TR6-P aims to provide a high-performance, high-capacity and robust SSD for mission-critical applications. The 3TR6-P models are designed with advanced firmware features such as fast erase, security erase, destroy and 256-bit AES encryption capability.

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Blade 3U VPX GPGPU with Nvidia RTX

Blade VPX 3U with MXM module (choice of RTX 5000 or 2000 ADA), following SOSA architecture, with cliam varnish and ETT support (-40 to +85°C), and conduction cooling. Optional: with 2 or 3 x PCIe x8, 1 x DP, 2 x USB3.0 and 2 x USB2.0, supports common PCIe clock mode or not.

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IP67 fanless PC box

The ECX700 PC supports the latest Intel Alder Lake-P generation in Core i5 and i7 to deliver the performance required for complex embedded applications. Its compliance with the IEC-60068-2-64 standard, and support for operation from -20 to 70°C, make it the ideal candidate for outdoor use.

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The Innodisk M.2 3MG2-P is based on the standard M.2 form factor with SATA interface, and supports the SATA III standard (6.0GB/s) with unrivalled performance. This storage solution will enable a reduction in footprint as well as a drastic increase in performance. It can operate in hostile environments (-55 -> +95°C).
The M.2 3MG2-P considerably reduces OS boot times and consumes 2x less power than a conventional HDD. It's fully compatible with the ATA protocol, so no additional driver is required. It can be used as a boot disk or a simple storage disk.

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The VTC7220-R, a fanless PC dedicated to the railway world, carries on board the Intel® Core™ i7-4650U processor.
Its CPU performance enables the user to adapt to any application in the railway field. Its Intel® HD graphics 5000 chipset guarantees efficient video processing with 3 different video outputs (VGA, DP, LVDS).
It is also equipped with 2 SSD/HDD drawers to facilitate storage management.
By integrating a wide range of inputs/outputs and 4 mini-PCIe slots, the VTC7220-R is not only suitable for video surveillance, but also for infotainment and dispatching systems.
With dual SIM support, the VTC7220-R enables a backup system for 3 SIM cards to guarantee better connectivity quality through software. What's more, the 3 SIM cards + dual WWAN modules architecture can drastically improve bandwidth for a tenfold increase in data transmission speed.
This system also supports intelligent power management, so the VTC7220-R can be "woken up" by ignition, RTC timer or remote SMS/Ring.

Featuring the latest generation of Intel® Atom™ processor E3826 (Bay Trail), the NISE 50 range will be perfectly suited to the fields of IoT, industrial automation or even Smart City. With up to 4GB of on-board DDR3L RAM, the NISE 50 can withstand temperatures ranging from -5 to +55°C with a supply voltage of 24V DC +/-20%. It also features an Ethernet port and an RS485 port, primarily for use with Modbus TCP or Modbus RTU. The Nise 50 has 3x mini-PCIe sockets that can support additional modules such as wifi, Bluetooth, 3.5G or 4G LTE cards for IoT. This makes the system the best possible choice for M2M and IoT.

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The ESM-KBLU is equipped with Intel® Kaby Lake 7th Gen Core™ SoC ULT i7/i5/i3 BGA processors and 2 260-pin DDR4 SO-DIMM slots up to 32GB. I/O present on the board are: 8xUSB 2.0, 4 x USB 3.0, 3 SATA III, 2x UART, 1 x 8-bit GPIO, 1 x SPI, 1 x SMBus, 1 x LPC and 1 x I2C.
In terms of graphic interfaces, the ESM-KBLU supports LVDS 1920 x 1200 @60Hz, Display Port 4096 x 2304 @60Hz, HDMI 4096 x 2160 @24Hz, DVI, VGA 1920 x 1200 @60Hz and eDP (Factory option).
The ESM-KBLU is ideal for digital signage, thin clients, ATMs, intelligent kiosks, industry and more.

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The ESM-APLC is equipped with Intel® Apollo lake Pentium® N4200 1.1GHz / 6W and Celeron® N3350 1.1GHz / 6W SoC processors. It supports 204-pin DDR3L 1866 SO-DIMM RAM up to 8 GB, as well as eMMC 5.0 memory up to 64GB (optional). I/O support includes 8 x USB 2.0, 4 x USB 3.0, 2 x SATA III, 1 x UART, 1 x 8-bit GPIO, 1 x SMBus, 1 x LPC and 1 x I2C. In terms of graphics interface, the card supports 18/24-bit dual-channel LVDS 1920 x 1200 @60Hz, VGA 1920 x 1200 @60HZ, HDMI 3840 x 2160 @30Hz and DP 4096 x 2160 @60Hz.
The card provides graphics management for up to 3 independent displays.
The TDP processor, with its 6W consumption, induces low power consumption and eliminates the problem of system overheating.
The ESM-APLC is ideal for applications requiring optimized yields and excellent graphics performance with low power consumption and long life.

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Diamond's SBC PC/104 family combines mid-range computing performance, standard I/Os and integrated data acquisition circuitry at an unbeatable price. On board: 3 (or 6) USB 2.0, 4 serial ports (2 RS-232/422/485 and 2 RS-232), 1 ethernet 10/100Mbps, 1 GbE port, plus a SATA port. Data acquisition circuitry includes 16 16-bit analog inputs, 4 16-bit analog outputs and 27 digital inputs/outputs configurable as counter/timer or pulse width modulator.
Helix is capable of incorporating I/O expansion boards with PC/104 modules. It also features a PCIe MiniCard socket. Diamond offers a wide range of additional cards compatible with the PCIe socket: wifi module, Ethernet, analog I/O, digital I/O, CAN bus etc.
The board is compatible with Linux and Windows embedded Standard 7. Development kits are available for Linux and Windows with an image and drivers to guarantee optimal development.
Helix is of course designed to withstand applications in more than hostile environments. Operating temperatures range from -40 to +85°C.

Processors and RAM
- Two Intel® Core™ i7-5700EQ CPUs
- Four Core, eight threads per CPU
- Dual channel 16 GBytes ECC 1600-DDR3L
- AVX2.0 Advanced VectorExtensions
- HD-5600 on-chip graphics

Security
- Configurable FPGA security hub
- Intel Trusted Execution
- New Intel ES instructions

Communication
- 10/40 Gigabit Ethernet data plane or PCIe™ gen 3 and OFED RDMA
- 665.6 GFLOPS per card slot

Software and libraries
- AXISPro, AXISFlow, AXISmpi libraries
- AXISLib VSIPL and RSPL multithreaded DSP and math libraries
- Quick start examples for signal and image processing
- Intel OpenCL SDKs, IPP and MKL

Connectivity
- 2x 1000BASE-T vPRO ports
- 4x USB-2, 2x USB-3
- 4x SATA-3
- 2x HDMI/DVI, 2x DisplayPort
- Serial, GPIO, HD audio

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EKF presents the PC6-TANGO, a low-power 4HP/3U CompactPCI® PlusIO CPU board, equipped with an Intel® Atom E39xx series (Apollo Lake) SoC processor. The front panel features two GbE connectors (M12-X optional), two USB 3.0 ports, two DisplayPorts and a slot for a Micro SD card.
The PC6-TANGO is equipped with 8GB of DDR3L ECC RAM soldered directly to the board, and a CFast® card slot for on-board SSD storage.
An optional 64GB eMMC flash memory chip can be incorporated.
A module with 2 M.2 SATA SSD slots.
The PC6-TANGO complies with the CompactPCI® PlusIO specification, making it ideal for expansion systems with CompactPCI® peripheral cards, as well as CompactPCI® Serial cards mounted on a hybrid backplane.

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