Business presentation
With its line of embedded and ruggedized PCs, EUKLEED serves markets requiring mission-critical applications that must operate 24/7 in environments subject to severe shock and vibration, with temperatures ranging from -40°C to +85°C.
With this embedded electronics product line, EUKLEED meets all the technical and economic requirements of the military, avionics, transportation, and security markets, which have needed to integrate PC technology into their deployments without compromising reliability, regardless of the constraints involved. EUKLEED is a distributor for leading manufacturers in their respective markets, committed to providing a comprehensive and cohesive product portfolio in this field:
- Form factors: PC104, ETX, 3″1/2, 5″1/4, EBX, SMARC, Q7...
- Packaging: Embedded Boxes, Multimedia Players, Rackable Systems, High Availability Blade Servers...
- And buses: PC104, PICMG, PC104+, PCI, PCIe, CompactPCI®, CompactPCI® PlusIO, CompactPCI® Serial, VME...
ECX700-ADP
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IP67 fanless PC box
The ECX700 PC supports the latest Intel Alder Lake-P generation in Core i5 and i7 to deliver the performance required for complex embedded applications. Its compliance with the IEC-60068-2-64 standard, and support for operation from -20 to 70°C, make it the ideal candidate for outdoor use.
VPX3-XMXM
Blade 3U VPX GPGPU with Nvidia RTX
Blade VPX 3U with MXM module (choice of RTX 5000 or 2000 ADA), following SOSA architecture, with cliam varnish and ETT support (-40 to +85°C), and conduction cooling. Optional: with 2 or 3 x PCIe x8, 1 x DP, 2 x USB3.0 and 2 x USB2.0, supports common PCIe clock mode or not.
3TR6-P
2.5' SSD for extreme conditions
The 3TR6-P 2.5" SATA3 SSD is the latest addition to the InnoRobust product range, adopting industrial 3D TLC NAND technology. The 3TR6-P aims to provide a high-performance, high-capacity and robust SSD for mission-critical applications. The 3TR6-P models are designed with advanced firmware features such as fast erase, security erase, destroy and 256-bit AES encryption capability.